Structural Test ICP® Accelerometers
Conventional structural test data systems use few to several hundred sensors. Cables bundles can be complex and confusing resulting in setup errors. Sensors with TEDS (Transducer Electronic Data Sheet) allow for an internal sensor digital chip to store sensor information. This information contains descriptive identifiers that when connected to a TEDS compatible signal conditioner or data system, reads the descriptive information and automatically aligns the data system. Human error is minimized, reducing time consuming data verification or re-test. The Series 333 ICP® accelerometers, and their accessories, are designed to address the needs of multi-point modal and structural test measurement applications. This equipment was developed in conjunction with the world renowned University of Cincinnati Structural Dynamics Research Laboratory and proven in real-world testing situations. The PCB 333 Series accelerometers delivers rapid system setup, reduces human documentation errors, maintains calibration data of each sensor, allows for “Plug-and-Play” installation, reduces overall test time lowering project test costs.
- High output piezoceramic sensing element for strong output signal
- Lightweight casing materials to minimize mass loading effects
- Available in a variety of packages, mounting and cable options
- Structural Vibration Testing
- Multi-channel Modal Analysis
- Analytical Model Correlation
- Ground Vibration Testing (GVT)
- Force Response Simulation
Structural ICP® accelerometer features:
- High-output, piezoceramic sensing elements for strong output signal levels when measuring lower-amplitude input vibrations
- Reduced mass-loading effects by employing ultra-lightweight casing materials
- minimal phase deviation, an important consideration for mode shape analysis
Each unit in this family includes TEDS functionality as an option. A sensor incorporating a Transducer Electronic Data Sheet (TEDS) is a mixed-mode (analog/digital) sensor with a built-in read/write memory that contains information about the sensor and its use. A TEDS sensor has an internal memory that includes information about the manufacturer, specifications and calibration, defined by IEEE standard 1451.4 This gives it the ability of “plug-and-play” self-identification within a measurement system. Using the same two-wire design of traditional piezoelectric with internal charge amplifier transducers, the TEDS sensor can flip between analog and digital modes, functioning with either a typical analog output, or with a digital bit stream output. Although a TEDS sensor can be connected to any ICP® sensor signal conditioner, only a TEDS-capable ICP® signal conditioner and data acquisition equipment support the digital communication mode.
Mounting pads, multi-conductor signal cables, and patch panels all help to control and organize the cable bundles of sensor arrays. This helps minimize set-up time and potential errors that are often the result of cable tangles encountered during multi-channel structural testing.