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Modal array, ceramic shear ICP® accel, 100 mV/g, 0.5 to 3k Hz, 10-32 side conn., adhesive mount
[1] Zero-based, least-squares, straight line method. [2] Typical. [3] See PCB Declaration of Conformance PS023 for details.
* All specifications are at room temperature unless otherwise specified.
(T) TEDS Capable of Digital Memory and Communication Compliant with IEEE P1451.4
(TLA) TEDS LMS International - Free Format
(TLB) TEDS LMS International - Automotive Format
(TLC) TEDS LMS International - Aeronautical Format
(TLD) TEDS Capable of Digital Memory and Communication Compliant with IEEE 1451.4
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